Method for manufacturing semiconductor structure

ABSTRACT

A semiconductor structure includes a first die, a second die, and a first conductive via. The first die includes a first dielectric layer and a first landing pad embedded in the first dielectric layer. The second die includes a second dielectric layer and a second landing pad embedded in the second dielectric layer. The first die is disposed on the second die. The second landing pad has a through-hole. The first conductive via extends from the first landing pad toward the second landing pad and penetrates through the through-hole of the second landing pad.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a Divisional Application of the U.S.application Ser. No. 16/601,575, filed Oct. 14, 2019, the entirety ofwhich is incorporated by reference herein in their entireties.

BACKGROUND Field of Invention

The present disclosure relates to a method for manufacturing asemiconductor structure. More particularly, the present disclosurerelates to a method for manufacturing a semiconductor structureincluding a conductive via penetrating a through-hole of a landing pad.

Description of Related Art

One of the major trends in the semiconductor industry is to minimize thesize of a semiconductor device. The demand for miniaturization isparticularly high in the semiconductor device package, such as multichippackage. For example, a multichip package includes integrated chips andfine-pattern printed circuits sealed with plastic resin or ceramicmaterial. Minimizing the size of integrated chips contained in thepackage was one of the primary objectives of package technicians.

SUMMARY

The present disclosure provides a semiconductor structure including afirst die, a second die, and a first conductive via. The first dieincludes a first dielectric layer and a first landing pad embedded inthe first dielectric layer. The second die includes a second dielectriclayer and a second landing pad embedded in the second dielectric layer.The first die is disposed on the second die. The second landing pad hasa through-hole. The first conductive via extends from the first landingpad toward the second landing pad and penetrates through thethrough-hole of the second landing pad.

In some embodiments, the first conductive via is separated from thesecond landing pad with the second dielectric layer.

In some embodiments, the first die is a slave die.

In some embodiments, the second die is a slave die.

In some embodiments, the semiconductor structure further includes athird die disposed under the second die, wherein the third die includesa first bump on a lower surface of the third die, and the firstconductive via extends through the third die to connect with the firstbump.

In some embodiments, the third die is a master die.

In some embodiments, the semiconductor structure further includes asecond conductive via extending from the second landing pad into thethird die, wherein the third die further includes a second bump on thelower surface of the third die, and the second conductive via isconnected with the second bump.

In some embodiments, the third die includes a third dielectric layer anda first bonding layer, and the first bonding layer is disposed betweenthe third dielectric layer and the second die.

In some embodiments, the second die further includes a second bondinglayer disposed between the second dielectric layer and the first bondinglayer.

In some embodiments, the first die further includes a first bondinglayer disposed between the first dielectric layer and the second die.

In some embodiments, the second die further includes a second bondinglayer disposed between the second dielectric layer and the first die.

The present disclosure provides a method for manufacturing asemiconductor structure. The method includes the following steps. Afirst die is bonded with a second die, wherein the first die is disposedon the second die. The first die includes a first dielectric layer and afirst landing pad embedded in the first dielectric layer. The second dieincludes a second dielectric layer and a second landing pad embedded inthe second dielectric layer. The second landing pad has a through-hole,and a portion of the second dielectric layer is filled in thethrough-hole of the second landing pad. A first hole is formed throughthe first die and the portion of the second dielectric layer of thesecond die to expose the first landing pad. A first conductive via isformed in the first hole.

In some embodiments, before forming the first hole, the method furtherincludes bonding a third die with the second die, wherein the third dieis disposed under the second die, wherein forming the first holeincludes forming the first hole through the third die.

In some embodiments, the method further includes the following steps. Asecond hole is formed through the second die and the third die to exposethe second landing pad. A second conductive via is formed in the secondhole.

In some embodiments, the third die is bonded with the second die by adirect bonding process.

In some embodiments, the method further includes forming a first bump ona lower surface of the third die, wherein the first bump is connectedwith the first conductive via.

In some embodiments, before bonding the first die with the second die,the method further includes forming the second die. Forming the seconddie includes the following steps. A conductive layer is formed on athird dielectric layer. The conductive layer is patterned to form thesecond landing pad having the through-hole. A fourth dielectric layer isformed to cover the second landing pad and the third dielectric layer.

In some embodiments, forming the fourth dielectric layer includes thefollowing steps. A fifth dielectric layer is formed to cover the secondlanding pad and the third dielectric layer. A portion of the fifthdielectric layer is removed to expose an upper surface of the secondlanding pad. A sixth dielectric layer is formed to cover the secondlanding pad and the fifth dielectric layer.

In some embodiments, the first die is bonded with the second die by adirect bonding process.

In some embodiments, the first die includes a first bonding layer, thesecond die includes a second bonding layer, and bonding the first diewith the second die includes bonding the first bonding layer of thefirst die and the second bonding layer of the second die.

It is to be understood that both the foregoing general description andthe following detailed description are by examples, and are intended toprovide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure can be more fully understood by reading the followingdetailed description of the embodiment, with reference made to theaccompanying drawings as follows:

FIG. 1A is a cross-sectional view schematically illustrating asemiconductor structure in accordance with some embodiments of thepresent disclosure.

FIG. 1B is a cross-sectional view schematically illustrating thesemiconductor structure in FIG. 1A along a line A-A′ in accordance withsome embodiments of the present disclosure.

FIG. 2 is a cross-sectional view schematically illustrating asemiconductor structure of a comparative example of the presentdisclosure.

FIGS. 3-6 are cross-sectional views of a method for manufacturing asemiconductor structure at various stages in accordance with someembodiments of the present disclosure.

FIGS. 7-13 are cross-sectional views of a method for manufacturing a dieat various stages in accordance with some embodiments of the presentdisclosure.

DETAILED DESCRIPTION

Reference will now be made in detail to the present embodiments of the,examples of which are illustrated in the accompanying drawings. Whereverpossible, the same reference numbers are used in the drawings and thedescription to refer to the same or like parts.

The following embodiments are disclosed with accompanying diagrams fordetailed description. For illustration clarity, many details of practiceare explained in the following descriptions. However, it should beunderstood that these details of practice do not intend to limit thepresent disclosure. That is, these details of practice are not necessaryin parts of embodiments of the present disclosure. Furthermore, forsimplifying the drawings, some of the conventional structures andelements are shown with schematic illustrations.

The present disclosure provides a semiconductor structure. FIG. 1A is across-sectional view schematically illustrating a semiconductorstructure 100 in accordance with some embodiments of the presentdisclosure. The semiconductor structure 100 includes a first die 110, asecond die 120, a third die 130, a first conductive via V1, a secondconductive via V2, a first bump B1, and a second bump B2. The first die110 is disposed on the second die 120. The third die 130 is disposedunder the second die 120. The first die 110 includes a first dielectriclayer 110 a and a first landing pad 110 b embedded in the firstdielectric layer 110 a. The second die 120 includes a second dielectriclayer 120 a and a second landing pad 120 b embedded in the seconddielectric layer 120 a. The third die 130 includes a third dielectriclayer 130 a. The first bump B1 and the second bump B2 are disposed on alower surface S1 of the third die 130. The first conductive via V1extends from the first landing pad 110 b toward the second landing pad120 b and penetrates through the through-hole h of the second landingpad 120 b. For example, the through-hole h may have a diameter less than20 μm. Moreover, the first conductive via V1 extends through the thirddie 130 to connect with the first bump B1. Further, the secondconductive via V2 extends from the second landing pad 120 b into thethird die 130 to connect with the second bump B2 on the lower surface S1of the third die 130.

In some embodiments, the first conductive via V1, the second conductivevia V2, the first landing pad 110 b, and the second landing pad 120 brespectively include copper, gold, tungsten, or alloys thereof. In someembodiments, the first dielectric layer 110 a, the second dielectriclayer 120 a, and the third dielectric layer 130 a respectively includessilicon dioxide (SiO₂), silicon nitride (SiN), silicon oxide-siliconoxynitride-silicon oxide (ONO), or a combination thereof.

In some embodiments, the first die 110 is a slave die. In someembodiments, the second die 120 is a slave die. In some embodiments, thethird die 130 is a master die. Signals can be transmitted from the thirddie 130 to the first die 110 through the first conductive via V1 andfrom the third die 130 to the second die 120 through the secondconductive via V2.

In some embodiments, the first die 110 is directly bonded with thesecond die 120. In some embodiments, the first die 110 is bonded withthe second die 120 by an oxide fusion bonding. In some embodiments, thefirst die 110 includes a bonding layer 110 c disposed between the firstdielectric layer 110 a and the second die 120 as show in FIG. 1A. Thefirst die 110 is bonded to the second die 120 with the bonding layer 110c. In some embodiments, the second die 120 includes a bonding layer 120c disposed between the second dielectric layer 120 a and the first die110 as show in FIG. 1A. The first die 110 is bonded to the second die120 with the bonding layer 120 c. In some embodiments, the bonding layer110 c and the bonding layer 120 c are oxide layers. In some otherembodiments, the first dielectric layer 110 a is in direct contact withthe second dielectric layer 120 a.

In some embodiments, the second die 120 is directly bonded with thethird die 130. In some embodiments, the second die 120 is bonded withthe third die 130 by an oxide fusion bonding. In some embodiments, thethird die 130 includes a bonding layer 130 b disposed between the thirddielectric layer 130 a and the second die 120 as show in FIG. 1A. Thesecond die 120 is bonded to the third die 130 with the bonding layer 130b. In some embodiments, the second die 120 includes a bonding layer 120d disposed between the second dielectric layer 120 a and the bondinglayer 130 b as show in FIG. 1A. The second die 120 is bonded to thethird die 130 with the bonding layer 120 d. In some embodiments, thebonding layer 120 d and the bonding layer 130 b are oxide layers. Insome other embodiments, the second dielectric layer 120 a is in directcontact with the third dielectric layer 130 a.

FIG. 1B is a cross-sectional view schematically illustrating thesemiconductor structure 100 in FIG. 1A along a line A-A′ in accordancewith some embodiments of the present disclosure. Please refer to FIGS.1A and 1B simultaneously. The second landing pad 120 b in the seconddielectric layer 120 a has the through-hole h. The first conductive viaV1 extends from the first landing pad 110 b toward the second landingpad 120 b and penetrates through the through-hole h of the secondlanding pad 120 b. The first conductive via V1 is separated and isolatedfrom the second landing pad 120 b with the second dielectric layer 120a. More specifically, a portion of the second dielectric layer 120 asurrounds the first conductive via V1, and the second landing pad 120 bsurrounds the portion of the second dielectric layer 120 a.

FIG. 2 is a cross-sectional view schematically illustrating asemiconductor structure 200 of a comparative example of the presentdisclosure. Please refer to FIGS. 1A and 2 simultaneously. In FIG. 1A,the first conductive via V1 penetrates through the through-hole h of thesecond landing pad 120 b. However, in FIG. 2, the second landing pad 120e does not have any through-hole, and therefore the first conductive viaV1 must be disposed beside the second landing pad 120 b. Generally, alanding pad would occupy a large space. For example, the width of thelanding pad may larger than 50 μm. Compared to the semiconductorstructure 100, the semiconductor structure 200 need more space fordisposing of the first conductive via V1, the second conductive via V2,the first landing pad 110 b, and the second landing pad 120 b.Accordingly, the semiconductor structure 100 of the present disclosurecan effectively utilize space and is beneficial for reducing the size ofthe semiconductor structure 100.

The present disclosure provides a method for manufacturing asemiconductor structure. FIGS. 3-6 are cross-sectional views of a methodfor manufacturing a semiconductor structure at various stages inaccordance with some embodiments of the present disclosure.

As shown in FIG. 3, a first die 110 is bonded with a second die 120, andthe second die 120 is bonded with a third die 130. The first die 110 isdisposed on the second die 120. The third die 130 is disposed under thesecond die 120. The first die 110 includes a first dielectric layer 110a and a first landing pad 110 b embedded in the first dielectric layer110 a. The second die 120 includes a second dielectric layer 120 a and asecond landing pad 120 b embedded in the second dielectric layer 120 a.The second landing pad 120 b has a through-hole h, and a portion of thesecond dielectric layer 120 a is filled in the through-hole h of thesecond landing pad 120 b.

In some embodiments, the first die 110 is bonded with the second die 120by a direct bonding process. In some embodiments, the first die 110 isbonded with the second die 120 by an oxide fusion bonding. In someembodiments, the first die 110 includes a bonding layer 110 c, and thesecond die 120 includes a bonding layer 120 c. The first die 110 isbonded with the second die 120 by bonding the bonding layer 110 c of thefirst die 110 and the bonding layer 120 c of the second die 120. In someother embodiments, the first die 110 is bonded with the second die 120by directly bonding the first dielectric layer 110 a and the seconddielectric layer 120 a.

In some embodiments, the second die 120 is bonded with the third die 130by a direct bonding process. In some embodiments, the second die 120 isbonded with the third die 130 by an oxide fusion bonding. In someembodiments, the second die 120 includes a bonding layer 120 d, and thethird die 130 includes a bonding layer 130 b. The second die 120 isbonded with the third die 130 by bonding the bonding layer 120 d of thesecond die 120 and the bonding layer 130 b of the third die 130. In someother embodiments, the second die 120 is bonded with the third die 130by directly bonding the second dielectric layer 120 a and the thirddielectric layer 130 a.

As shown in FIG. 4, a first hole H1 is formed through the first die 110,the second die 120, and the third die 130 to expose the first landingpad 110 b, and a second hole H2 is formed through the second die 120 andthe third die 130 to expose the second landing pad 120 b. Morespecifically, the first hole H1 is formed through a portion of thesecond dielectric layer 120 a which is filled in the through-hole h ofthe second landing pad 120 b.

As shown in FIG. 5, a first conductive via V1 is formed in the firsthole H1, and a second conductive via V2 is formed in the second hole H2.

As shown in FIG. 6, a first bump B1 is formed on the lower surface S1 ofthe third die 130 to connect with the first conductive via V1, and asecond bump B2 is formed on the lower surface S1 of the third die 130 toconnect with the second conductive via V2 to form a semiconductorstructure 100. The semiconductor structure 100 of the present disclosurecan effectively utilize space and is beneficial for reducing the size ofthe semiconductor structure 100.

The present disclosure provides a method for manufacturing a die. Insome embodiments, the second die 120 shown in FIG. 3 is manufactured bythe steps shown in FIGS. 7-13. FIGS. 7-13 are cross-sectional views of amethod for manufacturing a die at various stages in accordance with someembodiments of the present disclosure.

As shown in FIG. 7, a carrier 710, a release film 720, a bonding layer120 d and a dielectric layer 740 are received. In some embodiments, thebonding layer 120 d is an oxide layer. As shown in FIG. 8, a conductivelayer 810 is formed on the dielectric layer 740. As shown in FIG. 9, theconductive layer 810 is patterned to form a landing pad 120 b having athrough-hole h, and expose the upper surface of the dielectric layer740.

Next, a dielectric layer is formed to cover the landing pad and thedielectric layer 740 and fill the through-hole h as shown in FIG. 12. Insome embodiment, the dielectric layer is formed by the steps describedin FIGS. 10-12. As shown in FIG. 10, a dielectric layer 1000 is formedto cover the landing pad 120 b and the dielectric layer 740. Thedielectric layer 1000 has a thickness greater than that of the landingpad 120 b. In some embodiments, the upper surface of the dielectriclayer 1000 is uneven. Subsequently, as shown in FIG. 11, a portion ofthe dielectric layer 1000 is removed to expose an upper surface of thesecond landing pad 120 b. In some embodiments, the portion of thedielectric layer 1000 is removed by a chemical-mechanical polishing(CMP) process. Next, as shown in FIG. 12, a dielectric layer 1200 isformed to cover the landing pad 120 b and the dielectric layer 1000.

As shown in FIG. 13, a bonding layer 120 c is formed on the dielectriclayer 1200. Therefore, a die similar to the die 120 shown in FIG. 3 isformed on the carrier 710 and the release film 720. In some embodiments,the bonding layer 120 c is an oxide layer.

Although the present invention has been described in considerable detailwith reference to certain embodiments thereof, other embodiments arepossible. Therefore, the spirit and scope of the appended claims shouldnot be limited to the description of the embodiments contained herein.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentinvention without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present inventioncover modifications and variations of this invention provided they fallwithin the scope of the following claims.

What is claimed is:
 1. A method for manufacturing a semiconductor structure, the method comprising: bonding a first die with a second die, wherein the first die is disposed on the second die, the first die comprises a first dielectric layer and a first landing pad embedded in the first dielectric layer, the second die comprises a second dielectric layer and a second landing pad embedded in the second dielectric layer, the second landing pad has a through-hole, and a portion of the second dielectric layer is filled in the through-hole of the second landing pad; forming a first hole through the first die and the portion of the second dielectric layer of the second die to expose the first landing pad; and forming a first conductive via in the first hole.
 2. The method of claim 1, before forming the first hole, further comprising bonding a third die with the second die, wherein the third die is disposed under the second die, wherein forming the first hole comprises forming the first hole through the third die.
 3. The method of claim 2, further comprising: forming a second hole through the second die and the third die to expose the second landing pad; and forming a second conductive via in the second hole.
 4. The method of claim 2, wherein the third die is bonded with the second die by a direct bonding process.
 5. The method of claim 2, further comprising forming a first bump on a lower surface of the third die, wherein the first bump is connected with the first conductive via.
 6. The method of claim 1, before bonding the first die with the second die, further comprising forming the second die, wherein forming the second die comprises: forming a conductive layer on a third dielectric layer; patterning the conductive layer to form the second landing pad having the through-hole; and forming a fourth dielectric layer to cover the second landing pad and the third dielectric layer.
 7. The method of claim 6, wherein forming the fourth dielectric layer comprises: forming a fifth dielectric layer to cover the second landing pad and the third dielectric layer; removing a portion of the fifth dielectric layer to expose an upper surface of the second landing pad; and forming a sixth dielectric layer to cover the second landing pad and the fifth dielectric layer.
 8. The method of claim 1, wherein the first die is bonded with the second die by a direct bonding process.
 9. The method of claim 1, wherein the first die comprises a first bonding layer, the second die comprises a second bonding layer, and bonding the first die with the second die comprises bonding the first bonding layer of the first die and the second bonding layer of the second die. 